頻率：39.000MHz
尺寸：6.0x3.5mm
Rakon晶體諧振器,QESM04110DT101039.000MHz,物聯網6G晶振，新西蘭進口晶振，Rakon瑞康晶振，型號：QESM04，編碼為：QESM04110DT101039.000MHz，頻率為：39.000MHz，小體積晶振尺寸：6.0x3.5mm封裝，SMD晶振，石英晶體諧振器，四腳貼片晶振，石英晶振，無鉛晶振，SMD石英晶體，工作溫度范圍：-40℃至+85℃。具有超小型，輕薄型，高精度，高性能，高品質，高質量，耐熱及耐環境特點。6035石英貼片晶振被廣泛應用于：移動通訊，無線網絡，無線局域網，藍牙模塊，物聯網，汽車電子，醫療設備，安防設備，平板電腦，數碼電子，智能家居，游戲機設備等應用。
Rakon晶體諧振器,QESM04110DT101039.000MHz,物聯網6G晶振 參數表
Parameter
Min
Typ
Max
Unit
Test condition / Description
Nominal frequency (Fn)
39
MHz
Calibration tolerance
±10 to
±50
ppm
Frequency at 25°C ± 2°C and
specified load capacitance
Reflow shift
±1
ppm
Frequency shift after reflow with 4
hours settling at 25°C
Operating temperature range
-20 to +70
-40 to +85
°C
Refer to ordering information
Storage temperature range
-40
+85
°C
Frequency stability
over temperature
±10 to
±50
ppm
Referenced to frequency reading at
25°C and the specified load
capacitance
Long-term stability (Aging)
±3
ppm
Frequency drift over 1 year at 25°C
Shunt capacitance (CO)
7.0
pF
Load capacitance (CL)
10
30
pF
Refer to ordering information
Drive level
10
100
µW
Equivalent series resistance (ESR)
10.000 to 10.999MHz
11.000 to 11.999MHz
12.000 to 15.999MHz
16.000 to 39.999MHz
40.000 to 80.000Mhz
100
80
60
40
70
Ω
Mode of vibration:
Fundamental (AT-cut)
Fundamental (AT-cut)
Fundamental (AT-cut)
Fundamental (AT-cut)
3rd Overtone (AT-cut)
Insulation resistance (IR)
500
MΩ
100 V ±15 V at 25°C
Rakon晶體諧振器,QESM04110DT101039.000MHz,物聯網6G晶振 尺寸圖
Rakon晶體諧振器,QESM04110DT101039.000MHz,物聯網6G晶振
6035mm體積的貼片晶振,可以說是目前小型數碼產品的福音,目前超小型的智能手機里面所應用的就是小型的貼片晶振,該產品最適用于無線通訊系統,無線局域網,已實現低相位噪聲,低電壓,低消費電流和高穩定度,超小型,質量輕等產品特點,產品本身編帶包裝方式,可對應自動高速貼片機應用,以及高溫回流焊接，產品無鉛對應，為無鉛產品.
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